Wire-less inductive devices and methods

A method of manufacturing an inductive device, comprising:

• forming a plurality of conductive pathways on both a first and a second substrate;
• disposing a core at least partly between said first and second substrates;
• and
• joining said first and second substrates including respective ones of said pathways, thereby forming said inductive device.

A system for providing an inductive device on an external substrate, comprising:

• a substrate header comprising:
• a cavity;
• and
• one or more windings comprising at least one trace disposed on at least one surface of said substrate header and a plurality of conductive vias disposed within said substrate header and in electrical communication with said at least one trace;
• a magnetic core disposed within said cavity;
• and
• an external substrate;
• wherein said external substrate further comprises at least one external substrate trace, said at least one external substrate trace in electrical communication with said plurality of conductive vias thereby forming an inductive device.

An inductive device, comprising:

• at least two substantially insulating elements, said elements each having a plurality of conductive pathways formed therein, and at least one of said elements comprising a recess adapted to receive a magnetically permeable core;
• and
• a magnetically permeable core, said core disposed at least partly between said plurality of elements and at least partly within said recess;
• wherein said conductive pathways of said at least two elements are in electrical communication so as to form one or more continuous electrical pathways throughout said inductive device.