Test mark structure, substrate sheet laminate, multilayered circuit substrate, method for inspecting lamination matching precision of multilayered circuit substrate, and method for designing substrate sheet laminate

An inspection mark structure, comprising:

• an inspection via hole, which is provided in any of substrate sheets constituting at least two layers of substrate sheet laminates;
• a round pattern electrode, which is formed on one face side of said substrate sheet provided with said inspection via hole, and provided around the end face of said inspection via hole so as to come into contact with said end face;
• and
• a conduction electrode, which is formed on the other face side of said substrate sheet provided with said inspection via hole, and provided so as to be electrically connected with the end face of said inspection via hole.

A method for inspecting lamination matching precision of a multilayered circuit substrate having:

• a plurality of substrate sheets having a via hole;
• a circuit electrode provided on said plurality of substrate sheet layers;
• and
• an inspection mark structure formed on said plurality of substrate sheet layers, said structure including an inspection via hole which is provided in any of substrate sheets constituting at least two layers of substrate sheet laminates, a round pattern electrode which is formed on one face side of said substrate sheet provided with said inspection via hole and provided around the end face of said inspection via hole at such a predetermined distance as not to come into contact with said end face or so as to come into contact with said end face, and a conduction electrode which is formed on the other face side of said substrate sheet provided with said inspection via hole and provided so as to be electrically connected with the end face of said inspection via hole,
• said method comprising the steps of:
• electrically connecting said conduction electrode and said round pattern electrode in said inspection mark structure;
• and
• determining that said lamination matching precision is held (A) when conduction does not occur by said connection in the case of said inspection mark structure having said round pattern electrode provided around the end face of said inspection via hole at such a predetermined distance as not to come into contact with said end face, or (B) when conduction occurs by said connection in the case of said inspection mark structure having said round pattern electrode provided around the end face of said inspection via hole so as to come into contact with said end face.