Apparatus for testing devices
AssigneeFormFactor, Inc.
InventorsEric D. Hobbs, Andrew W. McFarland
Life of this patent
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Abstract
Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
Claims34
An assembly for testing semiconductor devices, comprising:
- a probe card assembly;
- and
- a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier restricting thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
An assembly for testing semiconductor devices, comprising:
- a probe card assembly;
- and
- a cap disposed above an upper central surface of the probe card assembly, the cap providing a barrier between tester side boundary conditions and portions of the probe card assembly disposed beneath the cap.
A probe card assembly, comprising:
- a wiring substrate having a tester side surface, an opposing wafer side surface, and a plurality of through holes extending therebetween;
- a support structure attached to the tester side surface of the wiring substrate and having portions extending into the through holes;
- a probe substrate located proximate to the wafer side surface of the wiring substrate and attached to the support structure;
- and
- a cap disposed on an upper surface of the support structure, the cap providing a barrier between tester side boundary conditions and portions of the probe card assembly disposed beneath the cap.
An assembly for testing semiconductor devices, comprising:
- a probe card assembly;
- and
- a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier restricting thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
Dependencies are inferred from the claim text.