Semiconductor and Method For Producing the Same
AssigneeInfineon Technologies AG
InventorsXaver Schloegel, Ralf Otremba
Life of this patent
Estimating the term…
Abstract
A semiconductor module and a method for producing the same is disclosed. One embodiment provides that an intermediate element has been or is formed, which has been or is formed for making electrical contact materially between a contact region provided and a connection region provided and in direct material and electrical contact with and for area adaptation between these.
Claims25
-10. (canceled)
An integrated circuit having a semiconductor module, comprising:
- a semiconductor region having a semiconductor element arrangement and including a surface region;
- a contact region formed on the surface region, configured to make electrical contact with the semiconductor element arrangement;
- a connection element in electrical contact with the contact region;
- and
- an intermediate element configured to make electrical contact between the contact region and the connection element.
An integrated circuit having a semiconductor module, comprising:
- a semiconductor region having a semiconductor element arrangement and including a surface region;
- a contact region formed on the surface region, configured to make electrical contact with the semiconductor element arrangement;
- a connection element in electrical contact with the contact region;
- and
- means for providing an intermediate element configured to make electrical contact between the contact region and the connection element.
A semiconductor module comprising:
- a semiconductor region having a semiconductor element arrangement and having a surface region;
- at least one contact region formed on the surface region of the semiconductor region, in external electrical contact with the semiconductor element arrangement;
- a connection element having a first end, which is formed in electrical contact with the contact region;
- and
- an intermediate element, formed in electrical contact materially between the contact region and the connection element and in direct material and electrical contact with and for area adaptation between the connection element and the contact region.
A method for producing a semiconductor module, comprising:
- forming a semiconductor region having a semiconductor element arrangement and having a surface region;
- providing at least one contact region formed on the surface region of the semiconductor region for externally making electrical contact with the semiconductor element arrangement;
- forming a connection element having a first end in electrical contact with the contact region;
- and
- forming an intermediate element for making electrical contact materially between the contact region and the connection element and in direct material and electrical contact with and for area adaptation between these.
Dependencies are inferred from the claim text.