Back to results
US 2008/0185735 A1Published application
Dynamic pad size to reduce solder fatigue
AssigneeFreescale Semiconductor, Inc.
InventorsTim V. Pham, Trent S. Uehling
Life of this patent
Estimating the term…
Abstract
A semiconductor device is provided which comprises a substrate (501) having a plurality of bond pads (503) disposed thereon. Each bond pad has a major axis and a minor axis in a direction parallel to the substrate, and the ratio of the major axis to the minor axis increases with the distance of a bond pad from the center of the substrate.
Claims20
A method for making a semiconductor device, comprising:
- providing a substrate;
- and
- creating a plurality of bond pads on said substrate, wherein each bond pad has a major axis and a minor axis in a plane parallel to the substrate, and wherein the ratio of the major axis to the minor axis increases with the distance of a bond pad from the center of the substrate.
A semiconductor device, comprising:
- a substrate having a plurality of bond pads disposed thereon;
- wherein each bond pad has a major axis and a minor axis in a direction parallel to the substrate, and wherein the ratio of the major axis to the minor axis increases with the distance of a bond pad from the center of the substrate.
A method for making a semiconductor device, comprising:
- providing an initial data set relating to the dimensions and position of a bond pad on a semiconductor substrate;
- determining an axis of expansion for the semiconductor substrate;
- adjusting the dimensions of at least one of said bond pads as a function of the axis of expansion, thereby deriving an adjusted data set;
- and
- using the adjusted data set to define a bond pad in a semiconductor device.
2 more elements
Dependencies are inferred from the claim text.