Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips

A stacked structure of semiconductor chips comprising:

• plural stacked semiconductor chips;
• and
• plural tabular holding members which hold the respective semiconductor chips, wherein
• at least two holding members among the holding members are arranged in places at ends of the semiconductor chips,
• at least one semiconductor chip of the two semiconductor chips held by the two holding members, respectively, is held by only one holding member of the holding members at one end of the semiconductor chip, and
• all or a part of the one semiconductor chip is arranged
• so as to be intersected the other semiconductor chip in the view of the direction of stacking, and arranged in the largest space positioned in an inner side of the inner side facet of the other holding member of the holding members, the largest space being formed by a surface including the one surface of the other holding member, a surface including the other surface of the other holding member, and a surface including a surface of the other semiconductor chip held by the other holding member, the other semiconductor chip being closer to the other holding member.

A semiconductor device, comprising:

• a plurality of semiconductor chips;
• and
• a plurality of substrates to which said semiconductor chips are mounted to, respectively;
• one of said substrates on a left side of said device, one of said chips mounted thereto extending past a right edge of said one of said substrates;
• another of said substrates on a right side of said device, another said of chips mounted thereto extending past a left edge of said another of said substrates;
• said another of said chips partially over and laterally offset relative to said one of said chips.