Microelectronic Circuit Structure With Layered Low Dielectric Constant Regions And Method Of Forming Same

An electrical microelectronic circuit structure, comprising:

• at least two generally parallel conductor structures;
• a plurality of substantially horizontal layers of layer dielectric material interspersed with substantially horizontally extending relatively low dielectric constant (low-k) volumes, said substantially horizontal layers and said substantially horizontally extending volumes being generally interposed between said at least two generally parallel conductor structures;
• and
• a plurality of substantially vertically extending relatively low-k volumes sealed within said substantially horizontal layers and said substantially horizontally extending volumes between said at least two generally parallel conductor structures;
• wherein said substantially vertically extending relatively low-k volumes and said substantially horizontally extending relatively low-k volumes reduce parasitic capacitance between said at least two generally parallel conductor structures as compared to an otherwise comparable microelectronic circuit not including said relatively low-k volumes.