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AssigneeIntegrated Circuit Solution Inc.
InventorMing-Feng Wu
Estimating the term…
A package structure and method for preventing gold bonding wires from collapsing are disclosed. The structure is especially useful for those chips whose two n×1 arrays of bonding pads are on the chip center to be packaged on a BGA substrate. According to the first preferred embodiment, two dies having a redistribution layer formed thereon are introduced outer the bonding pad array on the chip so that the gold bonding wires can be divided into two sections each to connect the bonding pads with the redistribution layer and the redistribution layer with the gold fingers on the BGA substrate. According to the second embodiment, the gold bonding wires are fixed by the epoxy strips on the chips after bonding the bonding pads to the gold fingers but before pouring liquid encapsulated epoxy into a mold.
A package structure for preventing gold bonding wires from collapsing, which is especially useful for those chips whose bonding pads are on the chip center to be packaged on a BGA substrate, the package structure comprising:
A package method for preventing gold bonding wires from collapsing, which is especially useful for those chips whose bonding pads are on the chip center to be packaged on a BGA substrate, wherein gold bonding wires bond two arrays of bonding pads on the chip center to the gold fingers before pouring liquid encapsulated epoxy into a mold, the package method comprising:
Dependencies are inferred from the claim text.