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US 2008/0185719 A1Published application
Integrated circuit packaging system with interposer
AssigneeSTATS ChipPAC, Ltd.
InventorsPhilip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Allan P. Ilagan
Life of this patent
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Abstract
An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
Claims20
An integrated circuit packaging system comprising:
- forming an interposer having a coupling slot;
- securing an upper die on the interposer;
- mounting the interposer over an integrated circuit;
- and
- coupling the integrated circuit to the upper die through the coupling slot.
2 more elements
An integrated circuit packaging system comprising:
- forming an interposer having a coupling slot;
- forming bond pads around the coupling slot;
- securing an upper die on the interposer including electrically connecting the upper die to a bond pad;
- mounting the interposer over an integrated circuit including positioning the coupling slot over the integrated circuit;
- and
- coupling the integrated circuit to the upper die through the coupling slot including bonding an electrical interconnect through the coupling slot.
3 more elements
An integrated circuit packaging system comprising:
- an interposer having a coupling slot;
- an upper die on the interposer;
- the interposer over an integrated circuit;
- and
- the integrated circuit coupled to the upper die through the coupling slot.
2 more elements
Dependencies are inferred from the claim text.