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US 2008/0185714 A1Published application
Methods of forming channels on an integrated circuit die and die cooling systems including such channels
AssigneeIntel Corporation
InventorsShriram Ramanathan, Chin Chang Cheng, Alan M. Myers
Life of this patent
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Abstract
A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.
Claims6
1-25. (canceled)
A device comprising:
- an integrated circuit die;
- and
- a cooling system coupled with the die, the cooling system comprising
- a number of channels disposed over a surface of the die,
- a barrier disposed on the die surface, the barrier extending about a periphery of the die and defining an interior region including the channels,
- an inlet reservoir within the interior region of the barrier, the inlet reservoir in fluid communication with at least some of the channels, and
- an outlet reservoir within the interior region of the barrier, the outlet reservoir in fluid communication with at least some of the channels.
4 more elements
30-41. (canceled)
Dependencies are inferred from the claim text.