Semiconductor package substrate
AssigneePhoenix Precision Technology Corporation
InventorShih-Ping Hsu
Life of this patent
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Abstract
A semiconductor package substrate structure includes a circuit board with a plurality of first connection pads formed on at least a surface thereof; conductive posts formed on the surfaces of the first connection pads; and an insulative protection layer formed on the surface of the circuit board and having openings formed to completely expose the conductive posts, the conductive posts protruding above the surface of the substrate, thereby the electrical connection between the conductive posts and a semiconductor chip is facilitated, and the quality and the reliability of subsequent packaging process are ensured.
Claims21
A semiconductor package substrate, comprising:
- a circuit board having a plurality of first connection pads formed on at least a surface thereof;
- a plurality of conductive posts formed on the surfaces of the corresponding first connection pads by electroplating;
- and
- an insulative protection layer formed on the surface of the circuit board and having openings formed to completely expose the conductive posts, the conductive posts protruding above surface of the insulative protection layer to allow mounting of a semiconductor chip.
A semiconductor package substrate, comprising:
- a circuit board having a plurality of first connection pads and second connection pads formed on at least a surface thereof;
- a plurality of conductive posts formed on the surfaces of the first connection pads by electroplating;
- and
- an insulative protection layer formed on the surface of the circuit board, and having openings formed to completely expose the conductive posts, the conductive posts protruding above the surface of the insulative protection layer to allow mounting of a semiconductor chip, and the insulative protection layer further having openings formed for exposing the second connection pads.
Dependencies are inferred from the claim text.