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US 2008/0185710 A1Published application
Chip package and process thereof
AssigneeUnited Microelectronics Corp.
InventorsMin-Chih Hsuan, Kai-Kuang Ho, Kuo-Ming Chen, Kuang-Hui Tang
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Abstract
The chip package and the process thereof are disclosed. The chip package comprises a chip and a rigid cover. The chip has a plurality of bond pads formed thereon. The rigid cover is located on the chip and has a plurality of openings formed therein, wherein the openings expose the bond pads on the chip respectively.
Claims10
A chip package, comprising:
- a chip having a plurality of bond pads formed thereon;
- and
- a rigid cover located on the chip and having a plurality of openings formed therein, wherein the openings expose the bond pads on the chip respectively.
Dependencies are inferred from the claim text.