Hermetically Sealed Package and Methods of Making the Same
AssigneeGeneral Electric Company
InventorsDonald Franklin Foust, William Francis Nealon
Life of this patent
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Abstract
Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device from environmental elements. A metal alloy sealant layer is employed proximate to the organic electronic device. Alternatively, a metal alloy sealant layer in combination with primer layer may also be implemented. Further, superstrates and edge wraps may be provided to completely surround the organic electronic device.
Claims20
A hermetically sealed package comprising:
- a first substrate configured to receive an organic electronic device;
- an organic electronic device disposed on an upper surface of the substrate;
- and
- a superstrate disposed proximate to the organic electronic device, wherein the superstrate comprises a peripheral portion adapted to wrap around edges of the package such that the peripheral portion of the superstrate is coupled to a lower surface of the substrate opposite the organic electronic device.
A method of fabricating a hermetically sealed electronic package comprising:
- disposing a plurality of organic electronic devices on a substrate;
- attaching each of the organic electronic devices to the substrate;
- cutting the substrate into a plurality of individual units, each comprising an attached organic electronic device;
- and
- affixing a superstrate over each of the individual units, wherein the superstrate comprises a peripheral portion adapted to wrap around edges of the substrate such that the peripheral portion of the superstrate is coupled to a lower surface of the substrate opposite the organic electronic device.
A hermetically sealed package comprising:
- a first substrate configured to receive an organic electronic device;
- an organic electronic device disposed on an upper surface of the substrate, wherein the organic electronic device comprises an organic electroluminescent device or an organic photovoltaic device;
- an insulating adhesive layer disposed above the organic electronic device;
- a superstrate coupled to the insulating adhesive layer and disposed proximate to the organic electronic device, wherein the superstrate comprises a peripheral portion adapted to wrap around edges of the package such that the peripheral portion of the superstrate is coupled to a lower surface of the substrate opposite the organic electronic device;
- and
- a metal alloy sealant layer disposed on the lower surface of the substrate such that the peripheral portion of the superstrate is hermetically sealed to the lower surface of the substrate.
Dependencies are inferred from the claim text.