Adhesive Film and Method for Manufacturing Semiconductor Device Using Same
AssigneeMitsui Chemicals, Inc.
InventorsNobuhiro Takamatsu, Shin Aihara
Life of this patent
Estimating the term…
Abstract
The invention provides an adhesive tape which acts as a dicing tape which is excellent in dicing property and pickup property in a dicing step, and as an adhesive tape which is excellent in connection reliability in a step of bonding a semiconductor device with a supporting member. The adhesive film comprises a layer in which an adhesive layer (A) comprising an olefin polymer and an adhesive layer (B) are directly laminated to each other, wherein the 180° peel strength between the layer (A) and the layer (B) is not more than 0.7 N/10 mm.
Claims11
An adhesive film comprising a layer in which an adhesive layer (A) comprising an olefin polymer and an adhesive layer (B) are adjacently laminated to each other, wherein the 180° peel strength between the layer (A) and the layer (B) is 0.7 N/10 mm or less.
Dependencies are inferred from the claim text.