Package-on-package device and method for manufacturing the same by using a leadframe

A package-on-package device comprising:

• a leadframe comprising:
• a die pad;
• a plurality of first leads, each having a first top surface and a first bottom surface;
• and
• a plurality of second leads, each including a top lead, a bottom lead and an intermediate lead physically connected to the top lead and the bottom lead, wherein each top lead has a second top surface, each bottom lead has a second bottom surface, the top lead and the bottom lead are non-coplanar, and the bottom lead and the first lead are coplanar;
• and
• a first chip mounted on the die pad and electrically connected to the first top surfaces of the first leads;
• a first encapsulant adapted to seal the first chip and a part of the leadframe, and adapted to expose the first bottom surfaces, the second top surfaces and the second bottom surfaces;
• and
• a second chip mounted on the first encapsulant and electrically connected to the second top surfaces of the top leads of the second leads.