US 2008/0185694 A1 · Processes of Manufacturing Portable Electronic Storage Devices Utilizing Lead Frame Connectors

Abstract

Portable electronic storage device (PESD) manufacturing methods utilizing lead frames are described. According to one exemplary embodiment, a process of manufacturing core unit of PESD comprises: producing a processed flash memory IC chip with several metal contact pads and at least one passive component located on top layer; pre-fabricating a lead frame having opposing first and second surfaces, a plurality of metal connectors disposed on the first surface and a cavity through both surfaces; attaching the top layer of the processed flash memory IC chip onto the first surface such that the metal connectors are electrically connected to the respective metal contact pads and the cavity provides an non-conductive space for the at least one passive component; and forming a molded enclosure on both surfaces of the lead frame to form a core unit, the mold enclosure is configured such that the connectors are exposed according to one of the PESD standards.

Claims20

Dependent claims

A process of manufacturing core unit of a portable electronic storage device (PESD) comprising:

producing a processed flash memory integrated circuit (IC) chip with a plurality of metal contact pads and at least one passive component located on top layer;
pre-fabricating a lead frame having opposing first and second surfaces, a plurality of metal connectors disposed on the first surface and a cavity or hole through both the first and second surface;
attaching the top layer of the processed flash memory IC chip onto the first surface such that the metal connectors are electrically connected to the respective metal contact pads and the cavity provides an non-conductive space for the at least one passive component;
and
forming a molded enclosure on the both first and second surfaces to form a core unit, the mold enclosure is configured such that the metal connectors are exposed.

2 more elements