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US 2008/0185692 A1Published application
Package-level electromagnetic interference shielding
AssigneeTexas Instruments Incorporated
InventorJames F. Salzman
Life of this patent
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Abstract
A shielded electronic package, comprising a semiconductor device, an insulating housing surrounding the semiconductor device and a metal coating on the insulating housing. The metal coating covers all but those portions of the insulating housing that are adjacent to connective structures on one or more mounting sides of the insulating housing.
Claims20
A shielded electronic package, comprising:
- a semiconductor device;
- an insulating housing surrounding said semiconductor device;
- and
- a metal coating on said insulating housing and covering all but those portions of said insulating housing that are adjacent to connective structures on one or more mounting sides of said insulating housing.
1 more element
An electrical device, comprising:
- a shielded electronic package including:
- a semiconductor device;
- an insulating housing surrounding said semiconductor device;
- and
- a metal coating on said insulating housing and covering substantially all but a mounting side of said insulating housing;
- and
- connective structures on said mounting side, said connective structures being electrically coupled to said semiconductor device;
- and
- a circuit board having conductive lines that interconnect said shielded electronic package to electronic components, wherein said shielded electronic package is mounted to said circuit board by coupling said conductive structures to one or more of said conductive lines.
6 more elements
A method of manufacturing a shielded electronic package, comprising:
- forming an insulating housing around a semiconductor device;
- and
- covering said insulating housing with a metal coating on all but those portions of said insulating housing that are adjacent to connective structures protruding from one or more mounting sides of said insulating housing.
Dependencies are inferred from the claim text.