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US 2008/0185673 A1Published application
Semiconductor Chip Module
AssigneeInfineon Technologies AG
InventorHorst Theuss
Life of this patent
Estimating the term…
Abstract
One aspect includes a sensor chip module including a sensor chip and a module housing accommodating the sensor chip. The module housing defines a mounting plane of the sensor chip module. In one case, an active surface of the sensor chip is inclined with respect to the mounting plane of the sensor chip module.
Claims31
A sensor chip module, comprising:
- a sensor chip;
- and
- a module housing accommodating the sensor chip, which module housing defines a mounting plane of the sensor chip module;
- wherein an active surface of the sensor chip is inclined with respect to the mounting plane of the sensor chip module.
1 more element
A module, comprising:
- a first semiconductor chip having an active surface, which is accommodated in a first housing;
- a second semiconductor chip having an active surface, which is accommodated in a second housing;
- and
- a common chip carrier, on which the first semiconductor chip and the second semiconductor chip are applied;
- wherein the two housings are joined together to form a common module housing and the chip carrier is bent in such a way that the active surface of the first semiconductor chip is inclined with respect to the active surface of the second semiconductor chip.
2 more elements
A method for producing a sensor module, comprising:
- producing a sensor chip housing with sensor chip accommodated therein;
- applying the sensor chip on a chip carrier;
- and
- bending the chip carrier into a mounting plane of the sensor chip housing such that an active surface of the sensor chip is inclined with respect to the mounting plane of the sensor chip housing.
1 more element
A method for producing a module, comprising:
- producing a first housing with a first semiconductor chip accommodated therein, said semiconductor chip being applied on a chip carrier;
- producing a second housing with a second semiconductor chip accommodated therein, said semiconductor chip being applied on the chip carrier, and
- bending the chip carrier in the region between the first housing and the second housing in order to join the first housing together with the second housing to form a common module housing.
Dependencies are inferred from the claim text.