Miniaturized imaging device with integrated circuit connector system

A stacked, miniaturized imaging device, comprising:

• a first layer comprising a support member having at least one alignment aperture disposed therein, the alignment aperture being oriented to position at least one conductive wire approximately perpendicular to a top surface of the support member;
• a second layer disposed on top of the first layer and comprising a SSID having at least one imaging array disposed thereon and associated electrical conductive contact points positioned on a top surface of the SSID;
• a third layer comprising a lens adaptor disposed on top of the second layer, the lens adaptor being configured to house a GRIN lens therein and further comprising at least one electrical conductive contact point disposed on an outer side surface of the lens adaptor, the at least one electrical conductive contact point continuously extending from a side surface of the lens adaptor to a bottom surface of the lens adaptor;
• and
• at least one conductive wire disposed within the alignment aperture and positioned to align the three layers in a stacked configuration, the conductive wire extending longitudinally along a corresponding side surface of the second and third layers and contacting the at least one electrical conductive contact point disposed on the outer surface of the lens adaptor;
• wherein the at least one conductive wire is bonded directly to at least one electrical conductive contact point on the side surface of the lens adaptor.

A stacked, miniaturized imaging device, comprising:

• a first layer comprising a substantially planar support member having at least two alignment apertures disposed on opposing sides thereof, the alignment apertures being oriented to position associated conductive wires approximately perpendicular to a top surface of the substantially planar support member;
• a second layer disposed on top of the first layer and comprising a substantially planar SSID having at least one imaging array disposed thereon and associated conductive contact points thereon;
• a third layer comprising a lens support member disposed at least partially on top of the second layer, the lens support member being configured to provide lateral support to a lens system;
• and
• at least one conductive wire disposed within each alignment aperture and positioned to align the first and second layers in a stacked configuration, the conductive wires extending longitudinally along a corresponding side surface of the second layer and being operatively coupled to the conductive contact points disposed on the outer surface of the SSID.