Sensor semiconductor package and fabrication

A fabrication method of sensor semiconductor packages, comprising:

• providing a wafer having a plurality of sensor chips, each of the wafer and the sensor chips having an active surface and an non-active surface opposing thereto, a sensor area and a plurality of bond pads formed on the active surface, and a plurality of grooves formed between the bond pads of the active surfaces of adjacent sensor chips;
• forming metal layers on positions corresponding to grooves and electrically connecting the bond pads of adjacent sensor chips;
• attaching a transparent body on the sensor chips to seal the sensor areas;
• performing a thinning process on the non-active surfaces of the wafer until respective portions of the metal layers are exposed from the non-active surfaces;
• forming a cover layer having openings on the non-active surfaces of the wafer for exposing the respective portions of the metal layers;
• forming conductive wirings on the cover layer to electrically connect to the respective portions of the metal layers exposed from the openings of the cover layer;
• forming a solder resist layer having openings on the cover layer and the conductive wirings for exposing terminals of the conductive wirings for deposing conductive elements thereon;
• and
• performing a cutting process cutting between adjacent sensor chips, so as to obtain a plurality of sensor semiconductor packages.