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AssigneeNXP B.V.
InventorsPatrice Gamand, Jean-Marc Yannou, Fabrice Verjus, Cyrille Cathelin
Estimating the term…
An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S1) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ1) of a printed circuit board (PCB), and a passive integration substrate (S2) set on top of the digital and/or analog integrated circuit (S1) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to, be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and Ëi) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.
Integrated circuit assembly (ICA) comprising a digital and/or analog integrated circuit having a core with input and/or output pins and at least one power supply connection pad and one ground connection pad connected to chosen one of said input and/or output pins and respectively intended for being connected to a power supply connection zone and aground connection zone of a printed circuit board (PCB), characterized in that it also comprises a passive integration substrate set on top of said digital and/or analog integrated circuit and comprising:
Dependencies are inferred from the claim text.