Resin-sealed semiconductor light receiving element, manufacturing method thereof and electronic device using the same
OwnerYuichiro KUSHIMATSU, Hirofumi Shindohinventors
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Abstract
A resin-sealed semiconductor light receiving element in which a light receiving element mounted on a circuit board is sealed with a transparent resin. A mounting face of the circuit board on which the light receiving element is mounted is sealed with a transparent epoxy resin so that a light receiving surface of the light receiving element is exposed, and at least the light receiving surface of the light receiving element is sealed with a transparent silicone resin.
Claims3
A resin-sealed semiconductor light receiving element in which a light receiving element mounted on a circuit board is sealed with a transparent resin,
- wherein a mounting face of the circuit board on which the light receiving element is mounted is sealed with a transparent epoxy resin so that a light receiving surface of the light receiving element is exposed, and at least the light receiving surface of the light receiving element is sealed with a transparent silicone resin.
A manufacturing method of a resin-sealed semiconductor light receiving element, comprising the steps of:
- mounting a plurality of light receiving elements on a circuit board;
- electrically connecting each of the light receiving elements to the circuit board;
- sealing a mounting face of the circuit board on which the light receiving elements are mounted with a transparent epoxy resin so that a light receiving surface of each of the light receiving elements is exposed;
- sealing the light receiving surfaces of the light receiving elements and a top surface of the transparent epoxy resin with a transparent silicone resin;
- and
- cutting the circuit board, the transparent epoxy resin and the transparent silicone resin by dicing to separate the light receiving elements on the circuit board.
Dependencies are inferred from the claim text.