Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device

A method for manufacturing an optical device comprising the steps of preparing an optical element wafer wherein a plurality of optical elements are vertically and horizontally arranged each having one of a light receiving region and a light emitting region, and a peripheral circuit region located around one of the light receiving region and the light emitting region on a major surface, and electrodes for external connection electrically connected to the peripheral circuit region formed on a back surface opposite to the major surface of the optical element;

• adhering a light-transparent member on one of each light receiving region and light emitting region in the optical element wafer using a light-transmitting adhesive;
• coating side surfaces of the light-transmitting member and a major surface of the optical element wafer with a molding resin while allowing release sheets to intervene between a mold surface and upper and lower surfaces of the optical element wafer, and clamping the system to fabricate an optical device wafer;
• and dividing the optical device wafer removed out of the mold into individual devices.

A method for manufacturing an optical device comprising the steps of preparing an optical element wafer wherein a plurality of optical elements are vertically and horizontally arranged each having one of a light receiving region and a light emitting region, and a peripheral circuit region located around one of the light receiving region and the light emitting region on a major surface, and electrodes for external connection electrically connected to the peripheral circuit region formed on a back surface opposite to the major surface of the optical element;

• adhering a light-transmitting member on one of each light receiving region and light emitting region in the optical element wafer using a light-transmitting adhesive;
• coating side surfaces of the light-transmitting member and a major surface of the optical element wafer with a molding resin by applying a liquid molding resin using screen printing to fabricate an optical device wafer;
• and dividing the optical device wafer into individual devices.