Portable memory devices

An electronic system, comprising:

• a data acquisition device;
• and
• a data storage device removably coupled to said data acquisition device, said data storage device storing data acquired by said data acquisition device, and said data storage device including at least:
• a circuit board having a first side and a second side, the first side including die attach pads, and the second side including I/O contacts and test contacts;
• at least one semiconductor die attached to the first side of said circuit board, said at least one semiconductor die being electrically connected to the die attach pads of said circuit board;
• a molding compound to encapsulate said at least one semiconductor die and the first side of said circuit board;
• and
• an ink coating provided over the test contacts on the second side of said circuit board but not over the I/O contacts on the second side of said circuit board.

An integrated circuit product produced in a batch by operations that include at least:

• providing a multi-instance leadframe or substrate having a plurality of instances, each of the instances of the leadframe or substrate having test contacts and input/output (I/O) contacts;
• attaching one or more dies to each of the instances on at least one side of the multi-instance leadframe or substrate;
• electrically connecting each of the one or more dies to the respective instance of the leadframe or substrate;
• thereafter encapsulating together the plurality of instances on the at least one side of the multi-instance leadframe or substrate with a molding compound, wherein the test contacts and the I/O contacts remain exposed;
• subsequently singulating each of the plurality of instances;
• testing each of the plurality of instances using the exposed test contacts;
• and
• printing ink over the exposed test contacts on the plurality of instances,
• whereby at least one of the plurality of instances being produced by said operations is said integrated circuit product.

An integrated circuit product, comprising:

• a circuit board having a front side and a back side, the front side including die attach pads, and the back side including I/O contacts and test contacts;
• at least one semiconductor die attached to the front side of said circuit board, said at least one semiconductor die being electrically connected to the die attach pads of said circuit board;
• a molding compound to encapsulate said at least one semiconductor die and the front side of said circuit board;
• and
• an ink coating provided over the test contacts on the back side of said circuit board but not over the I/O contacts on the back side of said circuit board.