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US 2008/0185361 A1Published application
Compositions for electronic circuitry applications and methods relating thereto
OwnerJohn D. Summersinventor
Life of this patent
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Abstract
Compositions useful in circuitry substrates are described which have a polyimide component, and a sterically hindered hydrophobic epoxy component. Generally, a flowable precursor is applied and then cured to a wholly or partially solidified mass. The invention is also directed to methods of forming a passive electrical component upon or into a circuit board.
Claims19
An electronic substrate comprising:
- a. a polyimide component having a glass transition temperature greater than 250° C., and
- b. a sterically hindered hydrophobic epoxy component, wherein the weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1, and
- wherein the substrate is a semiconductor device stress buffer layer, an interconnect dielectric layer, a circuitry protective overcoat layer, a bond pad redistribution layer, or a solder bump under fill.
A method of forming a passive electrical component for a circuit board, comprising:
- (a) preparing a composition comprising a polyimide component, a sterically hindered hydrophobic epoxy and an organic solvent;
- (b) applying this composition to an electrically conductive foil;
- (c) heating the printed foil so as to bond the composition to the foil, to remove the screen printing solvent, and to cure the formulation to form a solid mass;
- (d) laminating the foil with the cured composition component side down to an organic circuit board so as to attach the composition to the organic circuit board;
- and
- (e) etching the foil to form at least one of two terminations that contact the composition to yield a passive electrical component.
3 more elements
Dependencies are inferred from the claim text.