Method for fabricating a printed circuit board having a coaxial via

A printed circuit board, comprising:

• a plurality of printed circuit board layers laminated together in a stacked configuration to form a single printed circuit board, wherein each printed circuit board layer in laminated stacked configuration comprises a plurality of layers configured in a stack so that the plurality of layers has a top layer and a bottom layer and at least one conductive layer;
• a hollow via formed through the plurality of layers, the hollow via having a defining surface, the defining surface having a conductive material applied thereon, the conductive material connecting to the at least one ground layer;
• within the hollow via, a conductor coated with non-conductive material;
• wherein the top layer and bottom layer are covered by dielectric layers and the top layer and bottom layer with are plated with a conductive material that connects to the conductor located within via;
• wherein a via in each printed circuit board is disposed within its printed circuit board layer such that it aligns with a via on a neighboring printed circuit board layer within the printed circuit board layers laminated together in the stacked configuration.

A printed circuit board, comprising:

• a plurality of layers configured in a stack so that the plurality of layers has a top layer and a bottom layer and at least one conductive layer;
• a through via disposed through the plurality of layers, wherein the via has applied to its inner surface a conductive material, the conductive material connecting to the at least one ground layer, wherein the via is filled with dielectric material, the dielectric material having an aperture that connects the top layer and the bottom layer;
• and a conductor coated with non-conductive material disposed within the dielectric material;
• wherein the top layer and bottom layer comprise dielectric layers and are plated with a conductive material that connects to the conductor located within via.