Multilayer wiring board and method of manufacturing the same

Abstract

A multilayer wiring board includes at least two wiring boards having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps are formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards, so that the bumps assume a slender shape as seen in plan view and that the bumps intersect each other. The pair of fin-shaped bumps are electrically connected to form an inter-board connection terminal. Further, an insulating layer is formed between the wiring boards, and protection films are formed to cover the entire surface except pad areas defined at predetermined positions on outer wiring layers of the wiring boards.

Dependencies are inferred from the claim text.