Environmental Protection Coating System and Method

A circuit board assembly comprising:

• a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another;
• a first protective dielectric layer overlying the outer surface;
• and
• a second dielectric layer overlying the first protective dielectric layer and the plurality of discrete electrical components, the second dielectric layer comprising a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 3.0, a dielectric loss less than 0.008, a moisture absorption less than 0.04 percent, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%.

A circuit board assembly comprising:

• a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another;
• a domed lid enclosure disposed over one of the plurality of discrete electrical components;
• and
• an additional dielectric coating overlying the outer surface and the domed lid enclosure.

A method comprising:

• providing a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another;
• coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer;
• and
• coating the first protective dielectric layer with a second dielectric layer, the second dielectric layer comprising a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), dielectric constant less than 2.7, dielectric loss less than 0.002, breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), temperature stability to 3000 Celsius, defect densities less than 0.5/centimeter, pinhole free in films greater than 50 Angstroms, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

A method comprising:

• providing a circuit board having an outer surface;
• attaching a plurality of discrete electrical components to the outer surface at an assembly level phase, each of the plurality of discrete electrical components being manufactured independently of one another;
• and
• coating, at the assembly level phase, the outer surface and the plurality of discrete electrical components with a first dielectric layer, the first dielectric layer comprising a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), dielectric constant less than 2.7, dielectric loss less than 0.002, breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), temperature stability to 3000 Celsius, defect densities less than 0.5/centimeter, pinhole free in films greater than 50 Angstroms, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.