Printed wiring board and method of manufacturing the same

A printed wiring board comprising:

• an insulation layer having a surface;
• a plurality of electrodes embedded in the insulation layer;
• a resistor formed on the surface of the insulation layer and electrically connected to the electrodes;
• and
• an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to at least of the electrodes,
• wherein the insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the resistor has a thickness which is set to be less than a thickness of the external connection conductive pattern.

A manufacturing method of a printed wiring board, comprising:

• forming a plurality of electrodes on a conductive layer formed on a substrate by a plating method;
• forming an insulation layer on the electrodes and the conductive layer;
• removing the substrate from the conductive layer;
• patterning the conductive layer except for a resistor forming region reserved for forming a resistor, thereby forming an external connection conductive pattern;
• and
• forming a resistor in the resistor forming region such that the resistor is separated by a space from the external connection conductive pattern.