Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (cmp) slurry
AssigneeInternational Business Machines Corporation
InventorTheodore G. Van Kessel
Life of this patent
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Abstract
A system (and method) for real-time measurement of trace metal concentration in a chemical mechanical polishing (CMP) slurry, includes an electromagnetic radiation flow cell carrying a CMP slurry, a slurry pickup head coupled to the flow cell, and an analyzer for measuring properties of the slurry flowing through the flow cell.
Claims19
A system for real-time measurement of trace predetermined material concentration in a chemical mechanical polishing (CMP) slurry, comprising:
- a CMP slurry flow cell analyzer for determining at least one of transmission and fluorescent properties of a slurry flowing through the cell;
- and
- a slurry pickup pumping head coupled to said flow cell.
A material concentration measurement system, comprising:
- a slurry flow cell for having a slurry flow therethrough;
- a radiation source for illuminating said slurry, such that radiation traveling through the flow cell produces fluorescence in predetermined material atoms contained in the slurry;
- and
- an analyzer for measuring, in real-time, a concentration of trace predetermined material atoms in the slurry in response to the fluorescence.
A system for real-time measurement of trace metal concentration in a chemical mechanical polishing (CMP) slurry, comprising:
- an optical flow cell for having a CMP slurry flow therethrough;
- and
- a slurry pickup head operatively coupled to said optical flow cell.
Dependencies are inferred from the claim text.