Methods of depositing epitaxial thermoelectric films having reduced crack and/or surface defect densities and related devices
AssigneeNextreme Thermal Solutions, Inc.
InventorsJonathan Pierce, Robert P. Vaudo
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AssigneeNextreme Thermal Solutions, Inc.
InventorsJonathan Pierce, Robert P. Vaudo
Estimating the term…
A substrate is provided including a growth surface that is offcut relative to a plane defined by a crystallographic orientation of the substrate at an offcut angle of about 5 degrees to about 45 degrees. A thermoelectric film is epitaxially grown on the growth surface. A crystallographic orientation of the thermoelectric film may be tilted about 5 degrees to about 30 degrees relative to the growth surface. The growth surface of the substrate may also be patterned to define a plurality of mesas protruding therefrom prior to epitaxial growth of the thermoelectric film. Related methods and thermoelectric devices are also discussed.
A method of fabricating a thermoelectric device, the method comprising:
A method of fabricating a thermoelectric device, the method comprising:
A thermoelectric device, comprising:
A thermoelectric film, comprising:
Dependencies are inferred from the claim text.