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AssigneeNitto Denko Corporation
InventorsMasayuki Yamamoto, Yasuji Kaneshima
Estimating the term…
An outer edge of a protective tape projected from a semiconductor wafer is fixed and held by a tape holding section. In the condition, a part of the projected protective tape is caught and supported with a tape supporting section with a face having lower adhesive property provided in the outside of the traveling groove for the cutter. Furthermore, the part of the protective tape having the outer edge fixed and held with the tape holding section is compulsorily deformed and inserted into a depression provided between the tape holding section and the tape supporting section. Thereby, the part of the protective tape located in a traveling groove for the cutter is tensioned outward. A cutter blade is stuck into this tensioned part, and cuts the protective tape all over the peripheries of the wafer
A method for cutting a protective tape of a semiconductor wafer, the method cutting, along with a contour of the semiconductor wafer, the protective tape applied on the surface of the semiconductor wafer,
An apparatus for cutting a protective tape of a semiconductor wafer, the apparatus cutting, along with a contour of the semiconductor wafer, the protective tape applied on the surface of the semiconductor wafer, by mounting and holding the semiconductor wafer on a holding table provided with a traveling groove for a cutter, and by rotating a cutter blade stuck into the traveling groove along with a periphery of the semiconductor,
Dependencies are inferred from the claim text.