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US 2008/0184558 A1Published application
Method of manufacturing printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorTakayuki Haze
Life of this patent
Estimating the term…
Abstract
This invention relates to a method of manufacturing a printed circuit board, in which a dummy metal frame enclosing the outer periphery of a product part is formed, thus simultaneously assuring the rigidity of the printed circuit board and minimizing the warping thereof thanks to the dummy metal frame left in place on a finished product, thereby realizing a structure compatible with conventional flip chip mounting lines.
Claims9
A method of manufacturing a printed circuit board, comprising:
- (a) providing a work substrate having a resin substrate and metal plates having rigidity equal to or higher than 100 GPa and formed on both surfaces of the resin substrate;
- (b) removing an inner portion of each of the metal plates, corresponding to a product part which enables a plurality of unit printed circuit boards to be integrally connected to each other, through etching, thus simultaneously exposing the resin substrate of the product part and forming a dummy metal frame enclosing an outer periphery of the product part;
- (c) forming through holes in the resin substrate of the product part;
- (d) forming an inner circuit pattern on the resin substrate of the product part having the through holes;
- (e) forming an insulating layer on the product part having the inner circuit pattern;
- (f) forming via holes in the insulating layer;
- (g) forming an outer circuit pattern on the insulating layer having the via holes;
- and
- (h) forming a solder resist layer on the product part having the outer circuit pattern, and then exposing portions of the circuit pattern, corresponding to a bump pad for semiconductor mounting and a soldering pad for connection with an external component, through solder opening.
6 more elements
Dependencies are inferred from the claim text.