Method for manufacturing integrated circuit device having antenna conductors

A method for manufacturing an integrated circuit device having antenna conductors, the method comprising the steps of:

• providing a wafer with a plurality of integrated circuit components, wherein each integrated circuit component on its surface includes a dielectric layer and an electrode embedded in the dielectric layer;
• forming an antenna conductor having a first end and a second end on the surface;
• forming a plurality of metal bumps respectively positioned on the first end and the second end by screen-printing;
• coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps;
• and
• removing a portion of the insulating layer to expose a top portion of each metal bump.