System and method for separating and packaging integrated circuits
AssigneeXCI, Inc.
InventorAntonio L. Reis
Life of this patent
Estimating the term…
Abstract
A system for separating ICs, including a controller, a fixture and a support material supply. The fixture is coupled to a stretchable substrate and the stretchable substrate has a diced semiconductor wafer secured thereto. The diced semiconductor wafer including the plurality of ICs. The fixture being capable of stretching the stretchable substrate so as to form a corresponding plurality of spaces between each of the plurality of ICs.
Claims17
A system for separating a plurality of ICs, comprising:
- a controller;
- a fixture, the fixture coupled to a stretchable substrate, the stretchable substrate having a diced semiconductor wafer secured thereto, the diced semiconductor wafer including a plurality of ICs, the fixture being capable of stretching the stretchable substrate so as to form a corresponding plurality of spaces between each of the plurality of ICs;
- and
- a support material supply.
The system of claim 9, further comprising a cutter for cutting the support material to form a plurality of supported ICs.
A system for separating a plurality of RFID integrated circuits, comprising:
- a controller;
- a fixture, the fixture coupled to a stretchable substrate, the stretchable substrate having a diced semiconductor wafer secured thereto, the diced semiconductor wafer including the plurality of RFID integrated circuits, the fixture being capable of stretching the stretchable substrate so as to form a corresponding plurality of spaces between each of the plurality of RFID integrated circuits;
- a support material supply;
- a cutter capable of cutting the support material to form a plurality of individually supported RFID integrated circuits;
- a printing system
- a source of electroplatable resin coupled to the printing system, wherein the printing system is capable of applying the directly electroplatable resin to the individually supported RFID integrated circuits.
Dependencies are inferred from the claim text.