Method For Forming A Coating With A Liquid, And Method For Manufacturing A Semiconductor Device

A method of forming a coating, the method comprising:

• supplying a solvent to a surface of a substrate;
• starting a supply of a coating liquid to the surface of the substrate while rotating the substrate at a first rotation speed, the substrate rotating at the first rotation speed for a first predetermined time;
• stopping a rotation of the substrate at a deceleration larger than 30000 rpm/sec;
• and
• after the substrate is stopped, rotating the substrate at a second rotation speed for a second predetermined time.

A method of forming a coating, the method comprising:

• dispensing a solvent to a surface of a substrate;
• starting a supply of a coating liquid to the surface of the substrate while rotating the substrate at a first rotation speed, the substrate rotating at the first rotation speed for a first predetermined time;
• rotating the substrate at a second rotation speed for a second predetermined time, the second rotation speed being faster than the first rotation speed;
• dispensing the coating liquid on the substrate during the second rotation speed;
• rotating the substrate at a third rotation speed for a third predetermined time, the third rotation speed being faster than the second rotation speed;
• ending the dispensing of the coating liquid onto the substrate before the substrate spins at the third rotation speed;
• stopping the rotation of the substrate at a deceleration larger than 30000 rpm/sec;
• and
• after the substrate is stopped, rotating the semiconductor substrate at a fourth rotation speed for a fourth predetermined time.