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US 2008/0176408 A1Published application
Method and apparatus for manufacturing semiconductor devices, control program and computer-readable storage medium
AssigneeTokyo Electron Limited
InventorsAkihito TODA, Hiroki Amemiya
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Abstract
A method for manufacturing a semiconductor device includes mounting a target substrate on a mounting table in a processing chamber; performing a plasma etching process via a resist mask; and performing an ashing process for removing the resist mask in the same processing chamber. Further, a temperature control of the target substrate is performed to increase the temperature of the target substrate higher than a temperature level in the plasma etching process in the ashing process.
Claims11
A method for manufacturing a semiconductor device, comprising:
- mounting a target substrate on a mounting table in a processing chamber;
- performing a plasma etching process via a resist mask;
- and then
- performing an ashing process that removes the resist mask in the processing chamber,
- wherein in the ashing process, a temperature control of the target substrate is performed to increase the temperature of the target substrate higher than that in the plasma etching process.
2 more elements
Dependencies are inferred from the claim text.