Making method for product information
AssigneeDisco Corporation
InventorYoshikazu Kobayashi
Life of this patent
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Abstract
A product information marking method including a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of the wafer. After performing the back side grinding step, a marking step for marking product information on the back side of each device by applying a laser beam to the back side of the wafer is performed before separating the devices from each other. Thus, the product information is marked on each device in the stage of the wafer.
Claims4
A product information marking method comprising:
- a back side grinding step for grinding the back side of a wafer having a plurality of devices formed on the front side so as to be partitioned by a plurality of separation lines, thereby obtaining a desired thickness of said wafer;
- and
- a marking step for marking product information on the back side of each device by applying a laser beam to the back side of said wafer.
Dependencies are inferred from the claim text.