Method for sawing a wafer and method for manufacturing a semiconductor package by using a multiple tape

A method for manufacturing semiconductor package comprising the following steps of:

• providing a wafer which has an active surface, a back surface and a plurality of longitudinal and transverse sawing lines, wherein the sawing lines are located on the active surface so as to define a plurality of dies;
• attaching a multiple tape on the active surface of the wafer, wherein the multiple tape includes a first tape and a second tape, the second tape is located between the first tape and the active surface of the wafer, and the second tape is transparent;
• grinding the back surface of the wafer;
• attaching a dicing tape on the back surface of the grinded wafer, wherein the dicing tape includes a bottom film;
• removing the first tape;
• sawing the wafer including the second tape along the sawing lines so as to separate the dies from one another;
• disposing an adhesive on a carrier;
• moving the die including the second tape to the adhesive of the carrier;
• mounting the die on the carrier and destroying the adhesion of the second tape by a method for simultaneously processing the adhesive and the second tape;
• removing the second tape;
• and
• completing the semiconductor package by a packaging process.