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US 2008/0176354 A1Published application
Method of uniform current distribution using current modified layer
AssigneeNational Central University
InventorsCheng-yi Liu, Te-Yuan Chung, Pen-ko Chou, Ching-Liang Lin
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Abstract
An electric device has a p-n diode, where the p-n diode is covered with a current modified layer (CML). With a resistance distribution of the CML, a current is decreased toward all directions from a point on a bonding pad between the CML and the p-n diode. Hence, a current is uniformly distributed on the CML by fine tuning the resistance distribution. Thus, an effectiveness of the electric device is improved.
Claims20
A method of a uniform current distribution using a current modified layer, comprising steps of:
- (a) obtaining a semiconductor with a p-n junction;
- and
- (b) deposing a resistance-varied transparent conducting layer on said semiconductor with said p-n junction to spread current.
Dependencies are inferred from the claim text.