Heat dissipation device having a locking device

A heat dissipation device adapted for dissipating heat generated by an electronic device mounted on a printed circuit board, comprising:

• a retention module adapted for mounting on the printed circuit board and surrounding the electronic device, the retention module comprising a first spring clip disposed at one side thereof;
• a heat sink adapted for contacting with the electronic device, being mounted on the retention module and having a portion pressed by the first spring clip to abut against a bottom wall of the retention module;
• and
• a locking device having a first end pivotally connected to the retention module, a second end engaging with the retention module and a pressing portion between the first and second ends and exerting a pressing force on the heat sink toward the bottom wall of the retention module.

A heat dissipation assembly comprising:

• a printed circuit board having a heat-generating electronic component mounted thereon;
• a back plate mounted under the printed circuit board;
• a retention module mounted on the printed circuit board, surrounding the heat-generating electronic component and securing with the back plate;
• a heat sink mounted on the retention module and thermally engaging with the heat-generating electronic component, the heat sink having a base plate and a plurality of fins extending upwardly from the base plate, wherein a bulge and a flange at two opposite lateral sides of the base plate are without the fins thereon;
• and
• a locking device having a first end pivotably mounted to the retention module, a second end locking with the retention module and a first spring clip located between the first and second ends and pressing the flange downwardly toward the electronic component.