US 2008/0174960 A1Published application

Clamshell enclosure for electronic circuit assemblies

AssigneeThemis Computer

InventorsWilliam E. Kehret, Dennis H. Smith

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Abstract

A clamshell enclosure is disclosed for providing thermal and kinetic management for an enclosed electronic circuit. The clamshell enclosure comprises a sealed clamshell casing containing the circuit, and a cover that in combination with a wall of the clamshell casing forms a duct. A heat exchanger conducts heat from the electronic circuit inside the clamshell casing to a thermal interface element located within the duct, and a thermally conductive gas moving through the duct comes into contact with the interface element, dispelling the heat and thereby cooling the enclosed electronic circuit. A cellular topology of the clamshell casing and of the cover provides stiffness to the enclosure and reduces the effects of shock and vibration on the enclosed electronic circuit.

Claims16

Dependent claims

An electronics enclosure for housing an electronic circuit, comprising:

a casing enclosing the electronic circuit, said casing substantially preventing external contaminants from coming into contact with the enclosed electronic circuit;
an enclosure cover mechanically attached to the casing;
a duct external to the casing, comprising a space between the enclosure cover and a wall of the casing;
and
at least one heat exchanger, further comprising:
a thermal connector, thermally coupled to the enclosed electronic circuit, and
an interface element, thermally coupled to said thermal connector and protruding from the interior of the casing into the duct;
wherein the casing is substantially sealed, wherein a thermally conductive substance moving through the duct comes in contact with the interface element, and wherein heat from the enclosed electronic circuit is conducted by the thermal connector to the interface element.

5 more elements

Dependencies are inferred from the claim text.