Mini-sized heat-dissipating module having an extra strength of assembled relationship
AssigneeSunonwealth Electric Machine Industry Co., Ltd.
InventorHorng Alex
Life of this patent
Estimating the term…
Abstract
A mini-sized heat-dissipating module includes a miniature heat-dissipating plate and a miniature fan unit. The miniature heat-dissipating plate has an assembling space, at least one airflow channel and at least one engaging portion. The assembling space and the airflow channel are provided on a top surface of the miniature heat-dissipating plate, wherein the assembling space is arranged at an end of the airflow channel. The miniature fan unit has an air inlet, an air outlet, a fan wheel and at least one engaging portion. The engaging portion of the miniature fan unit is engaged with that of the miniature heat-dissipating plate when assembled. An adhesive layer is further provided to combine the miniature fan unit with the miniature heat-dissipating plate.
Claims18
A mini-sized heat-dissipating module, comprising:
- a miniature heat-dissipating plate having an assembling space, at least one airflow channel and at least one engaging portion, the assembling space and the airflow channel provided on a top surface of the miniature heat-dissipating plate, the assembling space being arranged at an end of the airflow channel;
- a miniature fan unit having a housing body, an air inlet, an air outlet, a fan wheel and at least one engaging portion, said fan wheel taking up a maximum area less than 1.6 cm2 for rotation;
- and
- an adhesive layer disposed between a surface of the miniature fan unit and the assembling space of the miniature heat-dissipating plate;
- wherein when assembled, the engaging portion of the miniature fan unit is engaged with that of the miniature heat-dissipating plate such that one of the air inlet and the air outlet of the miniature fan unit is aligned with the airflow channel of the miniature heat-dissipating plate.
Dependencies are inferred from the claim text.