Electromechanical element, electric circuit device and production method of those

A method of fabricating an electromechanical element including a mechanically movable element through a hollow formed on a substrate, comprising the steps of:

• forming a movable element through a sacrifice layer,
• penetrating to form a plurality of holes in the movable element through which the sacrifice layer is exposed, and
• performing at least a first etching and second etching on the sacrifice layer, wherein
• the first etching includes etching the sacrifice layer from a circumference of the movable element and from limbs of the holes in the movable element to form support portions for the movable element using residual portions of the sacrifice layer that are not etched from the circumference of the movable element and from the limbs of the holes in the movable element, and the second etching includes removing the residual portions of the sacrifice layer located under the movable element such that the resultant sacrifice layer can be in a movable condition.

A method of fabricating an electric circuit device, comprising the steps of:

• forming a movable element through a sacrifice layer, penetrating to form a plurality of holes in the movable element through which the sacrifice layer is exposed, and performing at least a first etching and second etching on the sacrifice layer, wherein
• the holes in the movable element are arranged such that a distance between one of the holes arranged in the same line and the other hole located at the closest position from the one of the two holes arranged in the same line is longer than a distance between the holes adjacently arranged in the same line,
• the first etching includes etching the sacrifice layer from a circumference of the movable element and from limbs of the holes in the movable element to form support portions for the movable element in a pillar shape or a wall shape using residual portions of the sacrifice layer that are not etched from the circumference of the movable element and from the limbs of the holes in the movable element, and
• the second etching includes removing the residual portions of the sacrifice layer located under the movable element such that the resultant sacrifice layer can be in a movable condition.