Vibration control pedestal and installation method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsSeok-Youn KIM, Jung-Sung HWANG, Ho-Young LEE, Do-Hyun KWUN, Jung-Shik HEO
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Abstract
A vibration control pedestal and an installation method thereof are disclosed, including a method for reducing particles and vibrations while moving equipment, including semiconductor equipment, from one vibration control pedestal to another. The vibration control pedestal includes an equipment support body having at least two equipment support cells. A cell connection unit passes through side surfaces of the equipment support cells and connects the equipment support cells to each other. A bottom structure installed under the equipment support body braces the equipment support body.
Claims20
A vibration control pedestal comprising:
- a bottom structure comprising a plurality of support beams;
- an equipment support body having at least two equipment support cells, the support beams being structured to brace the equipment support body;
- and
- at least one cell connection unit extending laterally through side surfaces of the at least two equipment support cells to couple the at least two equipment support cells to each other.
A vibration control pedestal comprising:
- a bottom structure comprising a plurality of support beams;
- an equipment support body having at least two rectangular support cells releasably secured to the bottom structure to provide support for semiconductor equipment, the at least two support cells having a planar surface, and the support beams being structured to brace the equipment support body;
- and
- at least one cell connection unit passing through side surfaces of the at least two support cells to couple the at least two support cells to each other.
A method for reducing airborne particles and vibrations while moving semiconductor equipment from one vibration control pedestal to another, comprising:
- preparing a first bottom structure;
- releasably securing at least two rectangular support cells with planar surfaces to the first bottom structure;
- laterally extending at least one cell connection unit through side surfaces of the at least two support cells to couple the at least two support cells to each other;
- placing the semiconductor equipment on the at least two support cells;
- releasing the at least two support cells from the first bottom structure, and
- moving the at least two support cells to a second bottom structure while maintaining the placement of the semiconductor equipment on the at least two support cells.
Dependencies are inferred from the claim text.