Controlling device for substrate processing apparatus and method therefor
AssigneeTokyo Electron Limited
InventorShinji SAKANO
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AssigneeTokyo Electron Limited
InventorShinji SAKANO
Estimating the term…
A TL performs a feed forward control and a feedback control of a PM. A storage unit stores a target value that serves as a control value when an etching process is performed on a wafer. A communication unit causes an IMM to measure a processing state of the wafer and receives measurement information. A computation unit computes a feedback value for the current wafer that is processed in the current cycle, based on pre-processing and post-processing measurement information. The computation unit computes a change value that is an amount of a change from a feedback value computed in a preceding cycle. A determination unit determines whether to discard the current computed feedback value by comparing the change value to a specified threshold value. An update unit, in a case where it is determined not to be discarded, uses the current computed feedback value in updating the target value.
A controlling device for a substrate processing apparatus that performs a specified process on a substrate, the controlling device comprising:
A control method for controlling a substrate processing apparatus that performs a specified process on a substrate, comprising:
A storage medium that stores a control program for a substrate processing apparatus that performs a specified process on a substrate, to control the substrate processing apparatus by executing the control program with a computer, the control program comprising:
Dependencies are inferred from the claim text.