Manufacturing methods of metal wire, electrode and tft array substrate
AssigneeBeijing Boe Optoelectronics Technology Co., Ltd.
InventorsChunping Long, Xinxin Li
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Abstract
A method of forming a gate line and gate electrode and a method of manufacturing a TFT array substrate. The metal gate line and gate electrode can be formed by: providing a substrate, forming a photoresist layer on the substrate, a photoresist pattern being formed complementary with that of the gate line and gate electrode, forming a metal Cu thin film or a composite thin film comprising a metal Cu thin film on the substrate, and removing the photoresist pattern and the metal Cu thin film or composite thin film comprising the metal Cu thin film formed thereon from the substrate.
Claims16
A method of forming a gate line and gate electrode, comprising the steps of:
- 1) providing a substrate;
- 2) forming a photoresist layer on the substrate, a photoresist pattern being formed complementary with a pattern of the gate line and gate electrode;
- 3) forming a metal Cu thin film or a composite thin film comprising a metal Cu thin film on the resulting substrate;
- and
- 4) removing the photoresist pattern and the metal Cu thin film or the composite thin film comprising the metal Cu thin film formed thereon from the resulting substrate, so as to form the gate line and gate electrode comprising the metal Cu thin film or the composite thin film comprising the metal Cu thin film.
A method of forming a data line and source/drain electrodes, comprising the steps of:
- 1) providing a substrate with an active layer formed thereon;
- 2) forming a photoresist layer on the substrate, a photoresist pattern being formed complementary with a pattern of the data line and source/drain electrodes;
- 3) forming a metal Cu thin film or a composite thin film comprising a metal Cu thin film on the resulting substrate;
- and
- 4) removing the photoresist pattern and the metal Cu thin film or the composite thin film comprising the metal Cu thin film formed thereon from the resulting substrate, so as to form the data line and source/drain electrodes comprising the metal Cu thin film or the composite thin film comprising the metal Cu thin film.
Dependencies are inferred from the claim text.