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US 2008/0166834 A1Published application
Thin film etching method
AssigneeSamsung Electronics Co., Ltd.
InventorsYeon-hee Kim, Jung-hyun Lee, Yong-young Park, Chang-soo Lee
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Abstract
Example methods may provide a thin film etching method. Example thin film etching methods may include forming a Ga—In—Zn—O film on a substrate, forming a mask layer covering a portion of the Ga—In—Zn—O film, and etching the Ga—In—Zn—O film using the mask layer as an etch barrier, wherein an etching gas used in the etching includes chlorine. The etching gas may further include an alkane (CnH2n+2) and H2 gas. The chlorine gas may be, for example, Cl2, BCl3, and/or CCl3, and the alkane gas may be, for example, CH4.
Claims16
A thin film etching method comprising:
- etching a Ga—In—Zn—O film using a mask layer as an etch barrier, the etching using an etching gas including chlorine.
Dependencies are inferred from the claim text.