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US 2008/0166555 A1Published application
Coarse-Particle Microcapsule Preparation
AssigneeBASF SE
InventorsGabriele Lang-Wittkowski, Ekkehard Jahns, Markus Steffen
Life of this patent
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Abstract
The present invention relates to a coarse-particled microcapsule preparation comprising microencapsulated latent heat accumulators and one or more polymeric binders, the ratio of surface area to volume of the particles obeying the following relationship: Surface area 2 Volume 3 ≥ 2.5 , and to processes for its production and its use in heat exchangers and building materials.
Claims21
1-20. (canceled)
21:
- A coarse-particled microcapsule preparation comprising one or more microencapsulated latent heat accumulator materials and one or more polymeric binders, the ratio of surface area to volume of the particles obeying the following relationship:
- Surface
-
-
- area
- 2
- Volume
- 3
- ≥
- 2.5
- .
8 more elements
22:
- The coarse-particled microcapsule preparation according to claim 1, 90% by weight of the particles being greater than 500 μm.
23:
- The coarse-particled microcapsule reparation according to claim 21, the binder content, calculated as solid, being 1-40% by weight, based on the total weight of the coarse-particled microcapsule preparation.
24:
- The coarse-particled microcapsule preparation according to claim 21, the latent heat accumulator material being a lipophilic substance having a solid/liquid phase transition in the temperature range from −20 to 120° C.
25:
- The coarse-particled microcapsule preparation according to claim 21, the latent heat accumulator material being an aliphatic hydrocarbon compound.
26:
- The coarse-particled microcapsule preparation according to claim 21, the capsule wall being a thermosetting polymer.
27:
- The coarse-particled microcapsule preparation according to claim 21, the capsule wall being composed of
- from 10 to 100% by weight of one or more C1-C24-alkyl esters of acrylic and/or methacrylic acid (monomers I)
- from 0 to 80% by weight of a bifunctional or polyfunctional monomer (monomers II) which is insoluble or sparingly soluble in water and
- from 0 to 90% by weight of other monomers (monomers III),
- based in each case on the total weight of the monomers.
2 more elements
28:
- The coarse-particled microcapsule preparation according to claim 21, the binder polymer having film-forming properties under processing conditions.
29:
- The coarse-particled microcapsule preparation according to claim 21, the binder polymer having a glass transition temperature of from −60 to 150° C.
30:
- The coarse-particled microcapsule preparation according to claim 21, the binder or being synthesized from one or more ethylenically unsaturated monomers M by emulsion polymerization.
31:
- The coarse-particled microcapsule preparation according to claim 21, the binder polymer being a homopolymer of vinyl esters of aliphatic carboxylic acids or a copolymer of vinyl esters of aliphatic carboxylic acids with olefins and/or alkyl (meth)acrylates.
32:
- The coarse-particled microcapsule preparation according to claim 21, the binder polymer being a copolymer of styrene with acrylonitrile.
33:
- The coarse-particled microcapsule preparation according to claim 21, the coarse-particled preparation comprising 2-20% by weight, based on the total weight of the preparation, of graphite.
34:
- The coarse-particled microcapsule preparation according to claim 33, the graphite being expanded graphite.
35:
- A process for the production of coarse-particled microcapsule preparations according to claim 21, wherein the microcapsules are brought, together with the polymeric binder and water, into a coarse-particled form and, if appropriate, then dried.
36:
- The process for the production of coarse-particled microcapsule preparations according to claim 35, wherein the microcapsules are extruded together with the polymeric binder dispersion at temperatures in the range from 25 K below to 50 K above the glass transition temperature of the binder polymer and if appropriate then dried.
37:
- The process for the production of coarse-particled microcapsule preparations according to claim 36, wherein extrusion is effected at temperatures in the range from 60 to 110° C.
38:
- The process for the production of coarse-particled microcapsule preparations according to claim 35, wherein extrusion is effected through a cross or star die.
The use of the coarse-particled microcapsule preparation according to claim 21 in heat exchangers.
40:
- The use of the coarse-particled microcapsule preparation according to claim 21 in building materials.
Dependencies are inferred from the claim text.