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US 2008/0165498 A1Published application
Quasi-radial heatsink with rectangular form factor and uniform fin length
AssigneeIntel Corporation
InventorsMark J. Gallina, Kevin Ceurter
Life of this patent
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Abstract
In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular cross sectional form factor. Other embodiments are disclosed and claimed.
Claims15
1-18. (canceled)
A system, comprising:
- a system board;
- an electronic component on the system board;
- and
- a heatsink thermally coupled to the electronic component, the heatsink comprising:
- a thermally conductive core;
- and
- at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,
- wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor,
- and wherein at least some of the fins extend directly from the thermally conductive core in an upward direction away from the electronic component.
6 more elements
Dependencies are inferred from the claim text.